LITMIR.BIZ

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SVM Support Vector Machine TCP Topological Close‐Packed TEM Transverse Electromagnetic Modes TGM Temperature Gradient Mechanism Ti Titanium TiC Titanium Carbide Ti‐HA Titanium‐Hydroxyapatite TMCs Titanium‐Matrix Composites TN True Negative TP True Positive TPMS Triply Periodic Minimal Surface TRL Technology Readiness Level TTT Transformation Time Temperature VC Vanadium Carbides VED Volumetric Energy Density VoF Volume‐of‐Fluid VTM Virtual Temperature Method WF Wire‐Fed WF‐EDED Wire‐Fed Electron Beam Directed Energy Deposition XRD X‐Ray Diffraction XRF X‐Ray Fluorescence YAG Yttrium Aluminum Garnet YLF Yttrium Lithium Fluoride YVO4 Yttrium Orthovanadate

Nomenclature

      Unless otherwise stated in the text, these symbols have the following meanings

aCharacteristic lengthaEnergy bilinear function for internal energy (Chapter 10)ASpot area – heat source interaction areaAFilament or nozzle cross‐section area (Chapter 7)AatAttenuated areaAcCross‐section areaIntersection of melt pool area on substrate and powder streamAjetCross‐section of powder stream on substrateAGProperty of filament materialAij, BijEinstein coefficientsASSurface areabMelt pool depthbBias (Chapter 11)BSize of gap (Chapter 7)BMagnetic fieldBDifferential shape function matrix (Chapter 10)cSpeed of lightcpHeat capacitycylFunction based on Bessel functionscsSpeed of sound in the fluidCDuty cycleCCompliance (Chapter 10)CaCapillary numberCsSolid compositionCLLiquid compositionCNominal alloy composition or solute concentrationdSpot sizedEuclidean distance (Chapter 11)dDroplet diameterd3, 2Surface mean particle diameterdconSemispherical dropletDLaser beam diameterDMaterial matrixDfDiffusion constantDijmnTensor of elastic coefficientsDLSolute diffusion coefficientDØDiffusion coefficienteWhen subscript or superscript, signifies a variable in its elemental formeiVector pointingELaser beam energyEElectric field (Chapter 5)EYoung’s modulus matrix (Chapter 10)EaEnergy of activationEbE‐beam energyEiInput laser energyEkinKinetic energyErReflected energyEtTransmitted energyEiEnergy levels (Chapter 3)EspecificThe energy enters the substrate from the surface in DEDfFrequencyfVolume fraction (Chapter 10)fsFraction of solidfLFraction of liquidf(R)Function of surface roughnessfi(x, t)Density of particles moving in the ei directionEquilibrium distributionFForceFFourier numberZero‐order Bessel function of its first kindThe first‐order Bessel function of the first kindFCapCapillary forceFstSurface tension forceFthThermal stress loadFWetWetting forcegGravitygiEffect of external forcesGTemperature gradientGSGibbs free energy for solidGLGibbs free energy for liquidGzGraetz numberΔGTotal Gibbs free energy changeΔG*Critical free energy changeΔGVFree energy change per unit volumehPlank's constant (Chapter 3)hHeight of a hexahedral element (Chapter 10)hcHeat convection coefficienthiConvective heat loss (cooling) coefficientshaAverage heat transfer coefficient of convectionhwDistance between the nozzle and surfacehrRadiative heat transfer coefficient hminMinimum radius of the liquid columnHBarrel length or height of trackH*Height of the melt polymer∆HEnthalpy differenceHDRHeating depth ratioIIntensity: energy per areaICurrent in electron beam (Chapter 5)I(x)Indicator function (Chapter 11)IIntensity scale factor or initial intensityIbBeam current in the electron‐beam processJFree electron currentkPropagation factorkEquilibrium distribution coefficient (Chapter 8)kSolute partition coefficient (Chapter 9)KThermal conductivityKGlobal stiffness matrix (Chapter 10)KcConductivity matrix (Chapter 10)KhConnective matrix (Chapter

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